New Skin Layers for New NAND

shutterstock 196857266 (230x153)The big news in NAND this month is all about layers. Chip sizes are constantly revised, especially when it comes to going smaller. However, more problems arise in planar (or 2D) construction as the chips shrink. The closer the cells are to each other, the higher the failure rate. This year, we have seen several announcements from NAND manufacturers regarding their plans for smaller chips. In April, Toshiba and SanDisk announced plans for a 15-nanometer (nm) chip and Micron announced a 16-nm triple-level-cell (TLC) chip for their cost-effective, consumer SSDs through Crucial. Production volumes of the 15-16-nm chips should continue to ramp up through the end of 2014.

Read more: New Skin Layers for New NAND

 

IoT Fueling the Smart Home Race

jetsons 2The "smart home" market is quickly picking up pace as this year we have seen a handful of important acquisitions by leading OEMs signaling their strategic goals in this still emerging market place, and more recent activity is signaling continued momentum.

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Smartphone and CE Device Wars Heat Up – Supply Chain Challenges Increase

shutterstock 91500506 (230x151)With less than a month until the anticipated release of major OEM smartphone and tablet PC devices, the buzz is intensifying, the supply chain is busy, and inventory calculators are showing signs of stocking in advance of the releases. From devices to service packages for smart devices, pricing is at the forefront and those competing for higher-priced devices are going to have to show consumers more reasons to upgrade than before, as refresh cycles have slowed.

Read more: Smartphone and CE Device Wars Heat Up – Supply Chain Challenges Increase

   

Intel Releases New Core for IoT and Low Power Growth Market

shutterstock 196857266 (230x153)This week, Intel released news pertaining to its core roadmap for 14nm process technology, along with the new, fifth-generation CPUs (code named "Broadwell") that will be marketed as "Intel® Core M processors." These new technologies are now in volume production. Tablet and Ultrabook devices will be showcased next month at the Consumer Electronics trade fair, IFA Berlin 2014, according to an Intel media brief. More importantly, Intel announced this week that the new line of consumer electronics devices with Core M technology will be available by the 2014 holiday season followed by PCs and servers in 2015.

Read more: Intel Releases New Core for IoT and Low Power Growth Market

 

Semi News Roundup: IC sales up 1H14; CE landscapes diversifying and ruggedizing; Automotive semi savior for opto?

shutterstock 203772724 (230x158)Closing out the first half of 2014 (1H14) brings us a good amount of data and rankings, while also giving us more solid footing for looking into the next quarter-plus of potential market movement. 2014 is proving to be a bit volatile, but, overall, is coming in with positive surprises for most, thanks to diversification opportunities from regional and price tiers and new market verticals.

Read more: Semi News Roundup: IC sales up 1H14; CE landscapes diversifying and ruggedizing; Automotive semi savior for opto?

   

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