New Skin Layers for New NAND
The big news in NAND this month is all about layers. Chip sizes are constantly revised, especially when it comes to going smaller. However, more problems arise in planar (or 2D) construction as the chips shrink. The closer the cells are to each other, the higher the failure rate. This year, we have seen several announcements from NAND manufacturers regarding their plans for smaller chips. In April, Toshiba and SanDisk announced plans for a 15-nanometer (nm) chip and Micron announced a 16-nm triple-level-cell (TLC) chip for their cost-effective, consumer SSDs through Crucial. Production volumes of the 15-16-nm chips should continue to ramp up through the end of 2014.
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IoT Fueling the Smart Home Race
The "smart home" market is quickly picking up pace as this year we have seen a handful of important acquisitions by leading OEMs signaling their strategic goals in this still emerging market place, and more recent activity is signaling continued momentum.
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