Smith Market Blog

COMPUTEX 2014: Intel's unveiling of Core M processors for hybrid growth


Day 2 at COMPUTEX Taipei: Intel's president, Renee James offered the COMPUTEX crowd some real news today. During her keynote, James announced the launch of Intel's latest generation of mobile processors: the 14nm fanless Broadwell processor, the Core M for 2-in-1 (or hybrid) PCs, and an SoC platform for low-cost mobiles (particularly important for emerging market device opportunities). James' keynote is particularly important for Intel because of the continued move away from traditional PCs in the global marketplace both for consumers and for many levels within the enterprise setting. Having a true hybrid tablet-PC will be a game changer, but there has yet to be a success story – that may change this year thanks to the latest generation of components and processors designed specifically for mobility. Additionally, supporting the entry-level, low-cost mobile devices will position Intel to support its clients who will compete in that growth market.

Efficiency at the core

The success of the next generation of devices, whether they are the booming wearables as discussed in yesterday's COMPUTEX blog, or in more traditional consumer electric (CE) devices such as smartphones, tablets, or the latest hybrid PCs, all rely on the design of the components at the device core. The reasons are relatively simple: power, heat, speed, connectivity and multitasking take the lead, with particular note to the first two.

Efficiency in power use is the cornerstone to unlocking successful mobile designs, whether as small as wearables, or as thin and portable as hybrid PCs. The problem comes down to batteries which is a different nut to crack and one we have to work with because the successful smart mobile device requires an 'always on' capability and that is all about power use. To solve the problem of power and hence battery life (since we aren't making battery progress as quickly as component progress), the engineering challenge has been to shrink the components, integrate the cores, reduce power consumption of these components so that efficiency extends the life of the device between charges.

With efficient power and heat dissipation (so that fans, and their added weight, are not required to be powered and use battery life to cool the device), important device design advances are made possible for the growing Internet of Things (IoT) ecosystem, including the portability and capabilities of truly hybrid devices, 2-in-1 PCs.

Seamless extension of ecosystems

As James noted, the IoT is not just about device expansion and design shrinks from the inside out, it is about a seamless connectivity and integration of devices and systems to support people's work, daily life, and entertainment demands as they move through different events during their day:

"The lines between technology categories are blurring as the era of integrated computing takes hold where form factor matters less than the experience delivered when all devices are connected to each other and to the cloud," said James. "Whether it's a smartphone, smart shirt, ultra-thin 2 in 1 or a new cloud service delivered to smart buildings outfitted with connected systems, together Intel and the Taiwan ecosystem have the opportunity to accelerate and deliver the value of a smart, seamlessly connected and integrated world of computing."

In evidence of the breadth of the IoT ecosystem, and the wide level of support Intel provides, many devices are being launched here at COMPUTEX, with over a dozen of the latest tablets on display based on Intel SoC and communication solutions. Again, James underscored that the IoT ecosystem that is developing today requires not only hardware but also software solutions that work together to provide the user with seamless experiences across devices, platforms, and a much broader set of use cases than we've seen before – we are truly entering the domain of ubiquitous computing and Intel unveiled many solutions demonstrating its commitment to support the next growth cycles. And, if the ubiquity of Intel's logo on the booths of its partners here at COMPUTEX is any sign, the Intel rollout is in full force.

There's certainly more to come from COMPUTEX Taipei 2014, we will continue to provide you with the most important news coming from the trade show floor daily. If you are here too, please stop by visit us at Booth J0601 in Nangang Hall, 1F in the Components and Parts Area.

Mark Bollinger
Written on Wednesday, 04 June 2014 17:25 by Mark Bollinger

Viewed 4393 times so far.
Like this? Tweet it to your followers!

Latest articles from Mark Bollinger

Hits: 4394


TrackBack URI for this entry

Comments (0)

Write comment

Copyright 2012 N.F. Smith & Associates LP.  All Rights Reserved.  View our Privacy Policy.

PlagSpotter - duplicate content checker tool


Contact Smith

Live Help