Japan Semiconductor Industry Responds Successfully to Earthquake/Tsunami Crisis

Read this week's issue - June 13, 2011

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Following the devastating earthquake, tsunami and electrical power crisis that severely impaired both the Japan and world semiconductor industry, many supply chain players now report that production has reached pre-earthquake levels with minimal risk to future shipments.  In addition, following formal requests from SEMI and other organizations, the Japanese government has excluded semiconductor fabs and many chemical plants from the 15% power cuts planned for this summer.

Damaged facilities have been repaired, electrical power supply interruptions that hindered chemical plants and fabs have been eliminated, and increased production from non-Japanese production facilities have significantly reduced the risk of further earthquake-related supply chain shortages. Many plants, including the Mitsubishi Gas Chemical electronic materials production subsidiary that manufactures the BT resin used in the majority of semiconductor packaging, has now recovered to the same level as normal operation before the earthquake.

Read more in the June 8, 2011 Semi article, "Japan Semiconductor Industry Responds Successfully to Earthquake/Tsunami Crisis"

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